thermal electroplasticity, direct numerical modeling, defective material, electromagnetic field and temperature localization.

The processes occurring in the metallic samples under the impact of electrical current of high density are consided. Investigation electroplastic effect is based on the constructed multiscale models of the impact of electromagnetic fields on microcracks. The dynamic problem is solved by direct numerical simulation. The evolution of microdefects of material in the form of flat cracks under action of electrical current are investigated. The influence of the size and orientation of microcracks on the localization of the electromagnetic field in the region of the defect are examined. Research has shown, that in the vicinity of the microdefects very large gradients electromagnetic field and current are arise, which leads to intensive heating and melting the material in the tips of the microcracks. The molten material flows into the microcrack, whereas microcrack are closing under the action of thermal stresses (the effect of "healing"of defects).

1. Kukudzhanov, Konstantin Vladimirovich Ph.D., Senior Research Scientist at the Department of Mechanics and Optimization of Structures, Institute for Problems in Mechanics of the Russian Academy of Sciences (IPMech RAS), Moscow 2. Kolomiets, Andrey Valer’evich Ph.D., Junior Research Scientist at the Department of Modeling in Solid Mechanics, Institute for Problems in Mechanics of the Russian Academy of Sciences (IPMech RAS), Moscow 3. Levitin Alexander Leonidovich Junior Research Scientist at the Department of Modeling in Solid Mechanics, Institute for Problems in Mechanics of the Russian Academy of Sciences (IPMech RAS), Moscow